BL631
 
 
 
Specifications
Case size
S.F.F Slim Chassis
M/B Form Factor
Micro ATX
Power Supply
Standard TFX 12V
I/O Expansion Slots
Low Profile Slots x 4
Dimension(H x W x D)
13" x 3.8" x 14.4"
330 x 96 x 365 mm (11.5L)
External Drive Bay
5.25" x 1, 3.5" x1
Internal Drive Bay
3.5" x 2
Thermal Solution
Intel Lanyu Ref. Design
Removable air filter New Partition Plate Cooling Tech New PPCT
Safety
Meets RoHS, CE, FCC Class B requirements
Security
Padlock loop / Kensington Lock
Optional
8cm side fan / IR / IEEE 1394 / Removable air filter/ Chassis intrusion switch
 
 
 
Features
 
Features +

Design Philosophy
A small 11.5L SFF chassis with optimal thermal and acoustic performance without additional system fan.
Excellent Thermal Solution
The innovative partition plate cooling technology (PPCT) maximizes performance while providing a quiet and cooling environment.
High Compatibility
It is compatible with standard desktop components, which makes the installation easier and provides a great expandability when needed.
Multi-Enjoyment
Designated Infrared Receiver position to support Media Center and optional Internal amplifier.
Small Form Factor Design
11.5 Liters
Intel Lanyu Ref. Design
Optimal thermal and acoustic performance without additional system fan
Detachable Drive Cage
For easy installation
Tool Free:
Optional screwless designs-ODD/FDD/HDD bays, expansion slots, and top cover clips for easy installation
Folded Edges
For safe assembly
Front Ports +

Standard USB 2.0 x 4 & HD Audio
Optional +

1394 (FireWire) x 1 - type A or B
IR
8cm Fan
Chassis Intrusion Switch
Tool Free +

Screwless ODD Bays Clips
 
Screwless FDD/HDD Bays Clips
 
Screwless Expansion Slots Clip
 
Screwless Top Cover Clips
 
System Thermal Testing Result +

CPU Ambient Average Temperature 36.6℃(98℉)
CPU
Core™ 2 Duo E8400 (3.0GHz)
Ambience Temperature
35℃(95℉)
Ta Average
36.6℃(98℉)
PSU out
37.5℃(99℉)
Host Bridge
64.7℃(148℉)
RAM
55.6℃(132℉)
HDD
49.6℃(121℉)
ODD
48.9℃(120℉)
FDD
47.4℃(117℉)
VGA
56.2℃(133℉)
•

 Lab Test: Intel Box CPU(Intel Core™ 2 Duo E8400 / 3.0GHz, LGA
775, 65W).
• Source from In Win lab. All examined sources are subject to change at anytime, without prior notice.
• Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of In Win products as measured by those tests. Any difference in system hardware, software design, or configuration may affect actual performance.
System Acoustic Result +

System Run
New PPCT
(With half-moon shaped air duct)
Idle
28.6 dB
Max Power
(CPU 100%)
33.9dB
.
PPCT +

This Partition Plate Cooling Technology is the world’s most advanced thermal & acoustic technology.
 

 

   
 
   
   
 
   
  BL Series uses Intel Lanyu as Ref. Design
New PPCT +
New PPCT Excellent Thermal & Acoustic Solution
New features of the 2nd generation of PPCT technology include removable air duct and an enlarged adjustable vent for various CPU positions.
Support LGA1156 Socket and downward compatible (LGA775)

 

Enlarged Vent
 
Removable Air Duct
 
Adjustable Position
 
  ＊New PPCT Technology supports LGA1156 Socket and downward compatible(LGA775).

Partition Plate to Guide Air Flow +